
Introduction:该设备主要用于石墨稀、納米材料工艺涂层、多晶硅、碳化硅、扩散、氧化、退火等工艺。
Temperature Range
1100°C/1400°C/1700°C
Door Opening Style
Side/ Top/ Bottom/ Bottom-lift/ Bogie
Process Applications
Sintering / Brazing / Heat Treatment
Heating Elements & Temp Zones
Resistance wire/ SiC/ MoSi₂
Single/ Multi-zones
Chamber Size
Standard / Custom
Custom Service Process
