
Introduction:主要应用于高等院校、科研院所、工矿企业等实验和小批量生产之用,用于电子陶瓷产品的预烧、烧结、镀膜、高温热解低温沉积(CVD)工艺等。
Temperature Range
1100°C/1400°C/1700°C
Door Opening Style
Side/ Top/ Bottom/ Bottom-lift/ Bogie
Process Applications
Sintering / Brazing / Heat Treatment
Heating Elements & Temp Zones
Resistance wire/ SiC/ MoSi₂
Single/ Multi-zones
Chamber Size
Standard / Custom
Custom Service Process
